Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)

Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
Double-sided Adhesive: Provides seamless and secure contact between surfaces
Versatile and Easy Application: Easily cut to the perfect size for your application